Study on radar electronic module cooling by using diamond/copper composites
Diamond/copper composites are regarded as a new generation of heat dissipation materials because of their good thermal conductivity and matched thermal expansion coefficient to semiconductor materials. This study focuses on the thermal application study of the diamond/copper composite. A diamond/cop...
Kaydedildi:
| Asıl Yazarlar: | , , |
|---|---|
| Materyal Türü: | Artigo |
| Dil: | Inglês |
| Baskı/Yayın Bilgisi: |
Taylor & Francis Group
2023-12-01
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| Seri Bilgileri: | Functional Diamond |
| Konular: | |
| Online Erişim: | http://dx.doi.org/10.1080/26941112.2023.2273320 |
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