Analytical Study of Contact Stress on Wafer Edge in CMP
Finite element analysis model was fabricated to confirm stress concentration phenomenon occurring in the wafer edge region in the CMP process, and it was confirmed if it corresponds to the measurement result of the actual pressure sensor. First, contact stress distribution at the edge of the wafer w...
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| Hauptverfasser: | , , , , , |
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| Format: | Artigo |
| Sprache: | Inglês |
| Veröffentlicht: |
Korean Society for Precision Engineering
2018-02-01
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| Schriftenreihe: | 한국정밀공학회지 |
| Schlagworte: | |
| Online-Zugang: | http://jkspe.or.kr/upload/pdf/NODE07319436.pdf |
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