Effect of Slurry Flow in Spray Slurry Nozzle System on Cu CMP
The chemical mechanical planarization (CMP) process combines the chemical effect of slurry with the mechanical effect of abrasive (slurry)-wafer-pads The slurry delivery system has a notable effect on polishing results, because the slurry distribution is changed by the supply method. Thus, the inves...
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| Glavni autori: | , , , , |
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| Format: | Artigo |
| Jezik: | Inglês |
| Izdano: |
Korean Society for Precision Engineering
2017-02-01
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| Serija: | 한국정밀공학회지 |
| Teme: | |
| Online pristup: | http://jkspe.or.kr/upload/pdf/KSPE_2017_v34n2_101.pdf |
| Oznake: |
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