Electrolytically Ionized Abrasive-Free CMP (EAF-CMP) for Copper
Chemical–mechanical polishing (CMP) is a planarization process that utilizes chemical reactions and mechanical material removal using abrasive particles. With the increasing integration of semiconductor devices, the CMP process is gaining increasing importance in semiconductor manufacturing. Abrasiv...
Сохранить в:
| Главные авторы: | , |
|---|---|
| Формат: | Artigo |
| Язык: | Inglês |
| Опубликовано: |
MDPI AG
2021-08-01
|
| Серии: | Applied Sciences |
| Предметы: | |
| Online-ссылка: | https://www.mdpi.com/2076-3417/11/16/7232 |
| Метки: |
Нет меток, Требуется 1-ая метка записи!
|