Electrolytically Ionized Abrasive-Free CMP (EAF-CMP) for Copper
Chemical–mechanical polishing (CMP) is a planarization process that utilizes chemical reactions and mechanical material removal using abrasive particles. With the increasing integration of semiconductor devices, the CMP process is gaining increasing importance in semiconductor manufacturing. Abrasiv...
-д хадгалсан:
| Үндсэн зохиолчид: | , |
|---|---|
| Формат: | Artigo |
| Хэл сонгох: | Inglês |
| Хэвлэсэн: |
MDPI AG
2021-08-01
|
| Цуврал: | Applied Sciences |
| Нөхцлүүд: | |
| Онлайн хандалт: | https://www.mdpi.com/2076-3417/11/16/7232 |
| Шошгууд: |
Шошго байхгүй, Энэхүү баримтыг шошголох эхний хүн болох!
|