Investigation of Planarization Using Real Contact Area Measurement in CMP Process
Chemical Mechanical Planarization (CMP) is an essential process for device integration and planarization in a semiconductor manufacturing process. The most critical function in the CMP process, is to predict and cover the geometrical characteristics of various sizes and densities, of patterned wafer...
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| Autors principals: | , , , , |
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| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
Korean Society for Precision Engineering
2022-08-01
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| Col·lecció: | 한국정밀공학회지 |
| Matèries: | |
| Accés en línia: | http://www.jkspe.or.kr/upload/pdf/NODE11104872.pdf |
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