Sn-0.7Cu-10Bi Solder Modification Strategy by Cr Addition
The application of Sn-0.7Cu-based composite solder in electronic packaging is limited due to its high melting point, poor wettability and low mechanical properties. Herein, we propose a strategy of adding Bi and Cr to improve the solderability of Sn-0.7Cu lead-free solder. The results show that the...
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| Autori principali: | , , |
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| Natura: | Artigo |
| Lingua: | Inglês |
| Pubblicazione: |
MDPI AG
2022-10-01
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| Serie: | Metals |
| Soggetti: | |
| Accesso online: | https://www.mdpi.com/2075-4701/12/10/1768 |
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