A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly
We successfully achieved low-temperature assembly by reflowing the 13.5Sn-37.5Bi-45In-4Pb quaternary eutectic solder paste and the SAC 305 solder ball together at 140 °C for 5 min. The wetting angle of the mixed solder joint is 17.55°. The overall atomic percent of Pb in the mixed solder joint is le...
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| Главные авторы: | , , , , , |
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| Формат: | Artigo |
| Язык: | Inglês |
| Опубликовано: |
MDPI AG
2022-05-01
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| Серии: | Micromachines |
| Предметы: | |
| Online-ссылка: | https://www.mdpi.com/2072-666X/13/6/867 |
| Метки: |
Нет меток, Требуется 1-ая метка записи!
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