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STRUCTURE AND techological improvments of tmbs diodes

An improved structure and technological process of trench MOS barrier Schottky (TMBS) diodes are developed and studied by 2D-simulation. The experiments performed demonstrated simplification of the technology by elimination of one photolithography and improvement of the diode parameters.

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Principais autores: V. S. Kotov, N. F. Golubev, V. E. Borisenko
Formato: Artigo
Idioma:Russo
Publicado em: Educational institution «Belarusian State University of Informatics and Radioelectronics» 2019-06-01
coleção:Доклады Белорусского государственного университета информатики и радиоэлектроники
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Acesso em linha:https://doklady.bsuir.by/jour/article/view/199
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