Thermal Performance Analysis of High-power IGBT Module Based on ANSYS
A three-dimensional FEA model of IGBT module is constructed by utilizing finite element analysis of ANSYS. Temperature distribution of the model under steady condition is analyzed and effects of baseplate material and thickness, solder material and layer thickness on thermal conduction performance o...
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| Автори: | , , , , |
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| Формат: | Artigo |
| Мова: | Chinês |
| Опубліковано: |
Editorial Office of Control and Information Technology
2012-01-01
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| Серія: | Kongzhi Yu Xinxi Jishu |
| Предмети: | |
| Онлайн доступ: | http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2012.02.002 |
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