Research on Baseplate Soldering Process of High-voltage IGBT Module
The solder layer between AlN substrate and AlSiC baseplate is a main way of heat dissipation for high-voltage IGBT module. Therefore, the void rate of the solder layer has a direct impact on the performance and reliability of high-voltage IGBT module. In this paper, using the SnAg free-lead solder p...
Na minha lista:
| Formato: | Artigo |
|---|---|
| Idioma: | Chinês |
| Publicado em: |
Editorial Office of Control and Information Technology
2011-01-01
|
| coleção: | Kongzhi Yu Xinxi Jishu |
| Assuntos: | |
| Acesso em linha: | http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2011.03.003 |
| Tags: |
Sem tags, seja o primeiro a adicionar uma tag!
|