Research on Baseplate Soldering Process of High-voltage IGBT Module
The solder layer between AlN substrate and AlSiC baseplate is a main way of heat dissipation for high-voltage IGBT module. Therefore, the void rate of the solder layer has a direct impact on the performance and reliability of high-voltage IGBT module. In this paper, using the SnAg free-lead solder p...
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| Format: | Artigo |
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| Sprache: | Chinês |
| Veröffentlicht: |
Editorial Office of Control and Information Technology
2011-01-01
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| Schriftenreihe: | Kongzhi Yu Xinxi Jishu |
| Schlagworte: | |
| Online-Zugang: | http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2011.03.003 |
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