Properties and microstructure regulation of electrodeposited ultra-thin copper foil in a simple additive system
Hydroxyethyl cellulose (HEC) has been commonly used in a variety of complex formulations for acid copper plating. However, the roles of HEC acting in acid copper plating still lacks of systematic investigation. To explore the efficacy of HEC in the deposition of the ultra-thin electrodeposited coppe...
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| Hlavní autoři: | , , , , , , |
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| Médium: | Artigo |
| Jazyk: | Inglês |
| Vydáno: |
IOP Publishing
2024-01-01
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| Edice: | Materials Research Express |
| Témata: | |
| On-line přístup: | https://doi.org/10.1088/2053-1591/ad4e9e |
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