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Properties and microstructure regulation of electrodeposited ultra-thin copper foil in a simple additive system

Hydroxyethyl cellulose (HEC) has been commonly used in a variety of complex formulations for acid copper plating. However, the roles of HEC acting in acid copper plating still lacks of systematic investigation. To explore the efficacy of HEC in the deposition of the ultra-thin electrodeposited coppe...

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Main Authors: Haiyang Chen, Kaibin Chen, Yinying Sheng, Jiahui Qu, Xiaojian Wang, Deqiang You, Dayong Shan
Format: Artigo
Language:Inglês
Published: IOP Publishing 2024-01-01
Series:Materials Research Express
Subjects:
copper foil
hydroxyethyl cellulose
electron backscatter diffraction
microstructure
nucleation
Online Access:https://doi.org/10.1088/2053-1591/ad4e9e
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