Effects of controlling grain growth mode on microstructures and properties of Cu foil
By means of direct current electrodeposition, Cu foil with columnar grain growth and equiaxed grain growth with different average grain sizes were prepared. Electron backscatter diffraction (EBSD), X-ray diffraction (XRD), atomic force microscopy (AFM), and transmission electron microscope (TEM) wer...
Збережено в:
| Автори: | , , , , , |
|---|---|
| Формат: | Artigo |
| Мова: | Inglês |
| Опубліковано: |
Elsevier
2023-05-01
|
| Серія: | Journal of Materials Research and Technology |
| Предмети: | |
| Онлайн доступ: | http://www.sciencedirect.com/science/article/pii/S2238785423005902 |
| Теги: |
Немає тегів, Будьте першим, хто поставить тег для цього запису!
|