Effects of controlling grain growth mode on microstructures and properties of Cu foil

By means of direct current electrodeposition, Cu foil with columnar grain growth and equiaxed grain growth with different average grain sizes were prepared. Electron backscatter diffraction (EBSD), X-ray diffraction (XRD), atomic force microscopy (AFM), and transmission electron microscope (TEM) wer...

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Detalhes bibliográficos

Principais autores:	Junqing Han, Yuying Wu, Kai Zhao, Haoran Wang, Shushuai Liu, Xiangfa Liu
Formato:	Artigo
Idioma:	Inglês
Publicado em:	Elsevier 2023-05-01
Colecção:	Journal of Materials Research and Technology
Assuntos:	Micron Cu foil Twin boundary density Electron backscatter diffraction (EBSD) Columnar crystal Equiaxed crystal
Acesso em linha:	http://www.sciencedirect.com/science/article/pii/S2238785423005902
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