Interfacial reaction and mechanical properties of Sn–Bi Cu core solder joints
Sn–Bi solder, considered to be a lead-free solder that can be used in the packaging of heat-sensitive devices, has been attracting increasing attention from researchers due to its excellent mechanical properties. The microstructure evolution, interfacial reaction, shear properties, and fracture beha...
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| Главные авторы: | , , , , , |
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| Формат: | Artigo |
| Язык: | Inglês |
| Опубликовано: |
Elsevier
2024-11-01
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| Серии: | Journal of Materials Research and Technology |
| Предметы: | |
| Online-ссылка: | http://www.sciencedirect.com/science/article/pii/S2238785424026371 |
| Метки: |
Нет меток, Требуется 1-ая метка записи!
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