Extracting and Analyzing the S-Parameters of Vertical Interconnection Structures in 3D Glass Packaging

In order to effectively employ through-glass vias (TGVs) for high-frequency software package design, it is crucial to accurately characterize the S-parameters of vertical interconnection structures in 3D glass packaging. A methodology is proposed for the extraction of precise S-parameters using the...

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Detalles Bibliográficos

Principais autores:	Jinxu Liu, Jihua Zhang, Libin Gao, Hongwei Chen
Formato:	Artigo
Idioma:	Inglês
Publicado:	MDPI AG 2023-03-01
Series:	Micromachines
Assuntos:	through-glass vias (TGVs) 3D glass packaging vertical interconnection transmission matrix (T-matrix)
Acceso en liña:	https://www.mdpi.com/2072-666X/14/4/803
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