Process Integration and Reliability Challenges of Through-Glass Vias for Glass-Based Advanced Packaging: A Focused Review

Recent advances in chiplet architectures, heterogeneous integration, 2.5D/3D packaging, high-performance computing, and RF applications have increased the demand for high-density vertical interconnects and low-loss packaging platforms. Glass substrates have attracted considerable attention for next-...

Ausführliche Beschreibung

Bibliografische Detailangaben

Hauptverfasser:	Dong Bae Park, Jinho Jo, Seonwoo Kim, Da-Yeong Lee, Suin Chae, Soobin Park, Se-Hoon Park, Tae-Young Lee, Kyoung-Min Kim, Nam Son Park, Seong-Eui Lee, Sang O Kim, Hyunjin Nam
Format:	Artigo
Sprache:	Inglês
Veröffentlicht:	MDPI AG 2026-06-01
Schriftenreihe:	Micromachines
Schlagworte:	through-glass via glass substrate advanced packaging metallization Cu filling conductive paste plugging
Online-Zugang:	https://www.mdpi.com/2072-666X/17/6/720
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