Balanced truncation model reduction for laser heating wafer model in frequency restricted domain
Modeling and simulating laser heating phenomena are crucial for optimizing manufacturing processes and ensuring high-quality final products. A major challenge in semiconductor manufacturing is achieving accurate, real-time temperature control during wafer heating. To reduce the computational burden...
Tallennettuna:
| Päätekijät: | , , , , |
|---|---|
| Aineistotyyppi: | Artigo |
| Kieli: | Inglês |
| Julkaistu: |
Elsevier
2024-12-01
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| Sarja: | Franklin Open |
| Aiheet: | |
| Linkit: | http://www.sciencedirect.com/science/article/pii/S277318632400121X |
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