Modeling and analyzing coupling noise effect of Cu-carbon nanotube composite through-silicon vias interconnects using NILT based

In the modern field of microelectronics, the performance of interconnects tends to decrease as the technology node advances. Therefore, Cu-CNT composite TSV interconnects are utilized due to their favorable performance. In this article, Cu-CNT composite TSV interconnects have been studied....

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Principais autores:	Ait Belaid Khaoula, Belahrach Hassan, Ayad Hassan, Ez-Zaki Fatima
Formato:	Artigo
Idioma:	Inglês
Publicado em:	Faculty of Technical Sciences in Cacak 2023-01-01
Colecção:	Serbian Journal of Electrical Engineering
Assuntos:	3d structures tsv cu-cnt composite nilt method t-matrix
Acesso em linha:	https://doiserbia.nb.rs/img/doi/1451-4869/2023/1451-48692303301A.pdf
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