An Analytical Modeling Study on the Thermal Behavior of Copper–Carbon Nanotube Composite Through-Silicon Via (TSV)
In this study, the Monte Carlo (MC) method is employed to generate the diameter and relative positional distributions of carbon nanotubes (CNTs). Based on this, we develop a three-layer thermal model for a copper-carbon nanotube (Cu-CNT) through-silicon via (TSV). By integrating Gauss–Hermite quadra...
I tiakina i:
| Ngā kaituhi matua: | , |
|---|---|
| Hōputu: | Artigo |
| Reo: | Inglês |
| I whakaputaina: |
MDPI AG
2026-03-01
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| Rangatū: | Nanomaterials |
| Ngā marau: | |
| Urunga tuihono: | https://www.mdpi.com/2079-4991/16/6/377 |
| Ngā Tūtohu: |
Kāore He Tūtohu, Me noho koe te mea tuatahi ki te tūtohu i tēnei pūkete!
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