An Analytical Modeling Study on the Thermal Behavior of Copper–Carbon Nanotube Composite Through-Silicon Via (TSV)
In this study, the Monte Carlo (MC) method is employed to generate the diameter and relative positional distributions of carbon nanotubes (CNTs). Based on this, we develop a three-layer thermal model for a copper-carbon nanotube (Cu-CNT) through-silicon via (TSV). By integrating Gauss–Hermite quadra...
Tallennettuna:
| Päätekijät: | , |
|---|---|
| Aineistotyyppi: | Artigo |
| Kieli: | Inglês |
| Julkaistu: |
MDPI AG
2026-03-01
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| Sarja: | Nanomaterials |
| Aiheet: | |
| Linkit: | https://www.mdpi.com/2079-4991/16/6/377 |
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