A Short Review of Through-Silicon via (TSV) Interconnects: Metrology and Analysis
This review investigates the measurement methods employed to assess the geometry and electrical properties of through-silicon vias (TSVs) and examines the reliability issues associated with TSVs in 3D integrated circuits (ICs). Presently, measurements of TSVs primarily focus on their geometry, filli...
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| Hauptverfasser: | , , , , , , |
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| Format: | Artigo |
| Sprache: | Inglês |
| Veröffentlicht: |
MDPI AG
2023-07-01
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| Schriftenreihe: | Applied Sciences |
| Schlagworte: | |
| Online-Zugang: | https://www.mdpi.com/2076-3417/13/14/8301 |
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