Modeling and Analysis of Wide Frequency Band Coaxial TSV Transmission Interconnect

In this paper, we first build the 3D model of coaxial TSV(CTSV), RDL, and bump of the CTSV interconnect, and extract the equivalent circuit model of each part. Then, we get the <i>S</i>-parameters of the 3D and equivalent circuit model of the CTSV interconnect structure; the validity of the equivale...

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Autors principals:	Yujie Zhang, Changle Zhi, Gang Dong
Format:	Artigo
Idioma:	Inglês
Publicat:	MDPI AG 2024-09-01
Col·lecció:	Micromachines
Matèries:	CTSV interconnect CTSV RDL bump equivalent circuit model <i>S</i>-parameter
Accés en línia:	https://www.mdpi.com/2072-666X/15/9/1127
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