Cyclic bend tests for the reliability evaluation of printed circuit boards under dynamic loads
The reliability of printed circuit boards under dynamic loads is a key issue in the handheld electronic products industry. In order to predict the performance of the boards in their application lifetime, different tests were developed. The current industry-wide standard testing method is a board lev...
שמור ב:
| Principais autores: | , |
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| פורמט: | Artigo |
| שפה: | Inglês |
| יצא לאור: |
Gruppo Italiano Frattura
2013-04-01
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| סדרה: | Fracture and Structural Integrity |
| גישה מקוונת: | https://www.fracturae.com/index.php/fis/article/view/109 |
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