Cyclic bend tests for the reliability evaluation of printed circuit boards under dynamic loads
The reliability of printed circuit boards under dynamic loads is a key issue in the handheld electronic products industry. In order to predict the performance of the boards in their application lifetime, different tests were developed. The current industry-wide standard testing method is a board lev...
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| Главные авторы: | , |
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| Формат: | Artigo |
| Язык: | Inglês |
| Опубликовано: |
Gruppo Italiano Frattura
2013-04-01
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| Серии: | Fracture and Structural Integrity |
| Online-ссылка: | https://www.fracturae.com/index.php/fis/article/view/109 |
| Метки: |
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