Metallization of polyetherimide with 3D structures by supercritical carbon dioxide-assisted electroless NiP plating
Polyetherimide (PEI) with 3-dimensional (3D) structures is a promising material for applications in electronic devices because of its numerous attractive properties. In the applications of PEI, the low electrical conductivity is often a shortcoming. The electrical conductivity can be improved by a m...
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| Autors principals: | , , , , , , , |
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| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
Elsevier
2024-09-01
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| Col·lecció: | Micro and Nano Engineering |
| Matèries: | |
| Accés en línia: | http://www.sciencedirect.com/science/article/pii/S2590007224000340 |
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