Impact of Hydrogen Voiding in Chip-to-Chip Electroless All-Copper Interconnections

Three-dimensional (3D) integration has become a leading approach in chip packaging. The interconnection density and reliability of micro-bumps in chip stacking are often threatened by high bonding temperatures. The method of building chip-to-chip interconnections by electroless deposition of metal h...

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Egile Nagusiak:	Nana Ren, Yuyi Zhang, Wenlong Shu, Chenxiao Lu, Wenjing Zhang, Zhuo Chen, Fuliang Wang
Formatua:	Artigo
Hizkuntza:	Inglês
Argitaratua:	MDPI AG 2024-04-01
Saila:	Micromachines
Gaiak:	3D integration electroless copper interconnection hydrogen-voiding microfluidic channel device
Sarrera elektronikoa:	https://www.mdpi.com/2072-666X/15/5/612
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