Synthesis of Quaternary Ammonium Gemini Levelers and Their Action Mechanisms in Microvias Void-Free Copper Filling
Developing a highly efficient leveler in acid copper electroplating solution is one of the primary tasks necessary for achieving superconformal filling of microvias and interconnections in printed circuit boards (PCBs). Two triethylenediamine-based Gemini levelers, both with terminal quaternary ammo...
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| Principais autores: | , , , , , , , , , , , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
MDPI AG
2025-09-01
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| coleção: | Colloids and Interfaces |
| Assuntos: | |
| Acesso em linha: | https://www.mdpi.com/2504-5377/9/5/62 |
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