Method for designing the topology of thin-film microassembly with film element sizes of 10–50 μm
The proposed method makes it possible to design thin-film elements with minimum sizes of 10–50 μm. The increase in microassembly integration is achieved by compensating for systematic errors in the structural parameters of thin-film elements, by modifying the algorithm for calculating resistor dimen...
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| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
Politekhperiodika
2004-10-01
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| Col·lecció: | Технологія та конструювання в електронній апаратурі |
| Matèries: | |
| Accés en línia: | https://tkea.com.ua/index.php/journal/article/view/1115 |
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