Method of layout design for microassembly boards
A method of layout design for microassembly boards is presented, characterized by high packing density and minimal manufacturing cost. The proposed method allows substantiating the choice of board material, taking into account the specific features of microassembly components and ensuring their ther...
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| Format: | Artigo |
| Sprache: | Inglês |
| Veröffentlicht: |
Politekhperiodika
2004-02-01
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| Schriftenreihe: | Технологія та конструювання в електронній апаратурі |
| Schlagworte: | |
| Online-Zugang: | https://tkea.com.ua/index.php/journal/article/view/1188 |
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