Effect of Additive Triblock Copolymer EPE-8000 on Bottom-up Filling in Copper Electroplating
The effect of triblock copolymer EPE upon the microvia filling by Cu electrodeposition was investigated by cross-sectional images using optical microscopy. The bottom-up filling of the electroplating bath was achieved with an addition of EPE. The electrochemical study indicated that the polarisation...
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| Principais autores: | , , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado: |
Elsevier
2014-01-01
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| Series: | International Journal of Electrochemical Science |
| Assuntos: | |
| Acceso en liña: | http://www.sciencedirect.com/science/article/pii/S1452398123077234 |
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