Effect of Additive Triblock Copolymer EPE-8000 on Bottom-up Filling in Copper Electroplating
The effect of triblock copolymer EPE upon the microvia filling by Cu electrodeposition was investigated by cross-sectional images using optical microscopy. The bottom-up filling of the electroplating bath was achieved with an addition of EPE. The electrochemical study indicated that the polarisation...
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| 主要な著者: | , , |
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| フォーマット: | Artigo |
| 言語: | Inglês |
| 出版事項: |
Elsevier
2014-01-01
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| シリーズ: | International Journal of Electrochemical Science |
| 主題: | |
| オンライン･アクセス: | http://www.sciencedirect.com/science/article/pii/S1452398123077234 |
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