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Effects of Etching Variations on Ge/Si Channel Formation and Device Performance

Abstract During the formation of Ge fin structures on a silicon-on-insulator (SOI) substrate, we found that the dry etching process must be carefully controlled. Otherwise, it may lead to Ge over-etching or the formation of an undesirable Ge fin profile. If the etching process is not well controlled...

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Auteurs principaux: Jiann-Lin Chen, Yiin-Kuen Fuh, Chun-Lin Chu
Format: Artigo
Langue:Inglês
Publié: SpringerOpen 2018-07-01
Collection:Nanoscale Research Letters
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Accès en ligne:http://link.springer.com/article/10.1186/s11671-018-2631-1
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