Creep of Sn-0.3Ag-0.7Cu solder in electronic packaging: Experiment and simulation
In contemporary society, the growing reliance on electronic devices has necessitated the phasing out of traditional Sn–Pb solder due to its health hazards, prompting a transition to environmentally friendly, lead-free alternatives.This study aims to address the challenges of poor interfacial reliabi...
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| Автори: | , , , , , |
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| Формат: | Artigo |
| Мова: | Inglês |
| Опубліковано: |
Elsevier
2025-01-01
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| Серія: | Journal of Materials Research and Technology |
| Предмети: | |
| Онлайн доступ: | http://www.sciencedirect.com/science/article/pii/S223878542402893X |
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