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Achieving Hydrophobic Ultralow Dielectric Constant Polyimide Composites: Combined Efforts of Fluorination and Porous Fillers

Abstract The advancement of the microelectronics industry necessitates the use of interlayer insulation materials with low dielectric constants and high mechanical properties. In this paper, a new type of copolymerized fluorinated polyimide (PI) is synthesized, and mixed with polyhedral oligomeric s...

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Principais autores: Wanjing Zhao, Chonghao Lu, Hui Zhao, Jingshu Huang, Jun‐Wei Zha, Xianwu Cao, Robert K. Y. Li, Wei Wu
פורמט: Artigo
שפה:Inglês
יצא לאור: Wiley-VCH 2022-09-01
סדרה:Macromolecular Materials and Engineering
נושאים:
dielectric properties
mechanical properties
mesoporous silica
polyimide
POSS
גישה מקוונת:https://doi.org/10.1002/mame.202200291
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