Thermal, Mechanical and Dielectric Properties of Polyimide Composite Films by In-Situ Reduction of Fluorinated Graphene

Materials with outstanding mechanical properties and excellent dielectric properties are increasingly favored in the microelectronics industry. The application of polyimide (PI) in the field of microelectronics is limited because of the fact that PI with excellent mechanical properties does not have...

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Bibliografski detalji

Glavni autori:	Yuyin Zhang, Tian Hu, Rubei Hu, Shaohua Jiang, Chunmei Zhang, Haoqing Hou
Format:	Artigo
Jezik:	Inglês
Izdano:	MDPI AG 2022-12-01
Serija:	Molecules
Teme:	polyimide fluorinated graphene composites dielectric properties
Online pristup:	https://www.mdpi.com/1420-3049/27/24/8896
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