Achieving Hydrophobic Ultralow Dielectric Constant Polyimide Composites: Combined Efforts of Fluorination and Porous Fillers
Abstract The advancement of the microelectronics industry necessitates the use of interlayer insulation materials with low dielectric constants and high mechanical properties. In this paper, a new type of copolymerized fluorinated polyimide (PI) is synthesized, and mixed with polyhedral oligomeric s...
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| Autors principals: | , , , , , , , |
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| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
Wiley-VCH
2022-09-01
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| Col·lecció: | Macromolecular Materials and Engineering |
| Matèries: | |
| Accés en línia: | https://doi.org/10.1002/mame.202200291 |
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