A Monolithic Three-Axis Accelerometer with Wafer-Level Package by CMOS MEMS Process
This paper presents a monolithic three-axis accelerometer with wafer-level package by CMOS MEMS process. The compositions of the microstructure are selected from CMOS layers in order to suppress the in-plane and out-of-plane bending deflection caused by the residual stresses in multiple layers. A sw...
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| Główni autorzy: | , , , , , , |
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| Format: | Artigo |
| Język: | Inglês |
| Wydane: |
MDPI AG
2017-08-01
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| Seria: | Proceedings |
| Hasła przedmiotowe: | |
| Dostęp online: | https://www.mdpi.com/2504-3900/1/4/337 |
| Etykiety: |
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