A Monolithic Three-Axis Accelerometer with Wafer-Level Package by CMOS MEMS Process

This paper presents a monolithic three-axis accelerometer with wafer-level package by CMOS MEMS process. The compositions of the microstructure are selected from CMOS layers in order to suppress the in-plane and out-of-plane bending deflection caused by the residual stresses in multiple layers. A sw...

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Bibliografiska uppgifter

Huvudupphov:	S. H. Tseng, C. Y. Yeh, A. Y. Chang, Y. J. Wang, P. C. Chen, H. H. Tsai, Y. Z. Juang
Materialtyp:	Artigo
Språk:	Inglês
Utgiven:	MDPI AG 2017-08-01
Serie:	Proceedings
Ämnen:	monolithic wafer-level package CMOS MEMS accelerometer
Länkar:	https://www.mdpi.com/2504-3900/1/4/337
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