Reliability Simulation of IGBT Module with Different Solders Based on the Finite Element Method
The interconnecting solder is a key control factor for the reliability of electronic power packaging because it highly affects the junction temperature of insulated-gate bipolar transistor (IGBT) modules and is prone to plasticity, creep, and other failure behaviors under temperature-change environm...
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| Autori principali: | , , , , |
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| Natura: | Artigo |
| Lingua: | Inglês |
| Pubblicazione: |
MDPI AG
2024-10-01
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| Serie: | Metals |
| Soggetti: | |
| Accesso online: | https://www.mdpi.com/2075-4701/14/10/1141 |
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