Finite element comparative study on creep and random vibrations of solder joints in BGA package
As the demand for increasing miniaturisation and functionality of electronic devices soars, understanding the creep and random vibration of solder joints (SJs) in BGA packages in devices is critical to achieving high device reliability. This research employs Finite Element Analysis (FEA) to evaluate...
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| Główni autorzy: | , , |
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| Format: | Artigo |
| Język: | Inglês |
| Wydane: |
Elsevier
2025-06-01
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| Seria: | Power Electronic Devices and Components |
| Hasła przedmiotowe: | |
| Dostęp online: | http://www.sciencedirect.com/science/article/pii/S2772370425000100 |
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