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Finite element comparative study on creep and random vibrations of solder joints in BGA package

As the demand for increasing miniaturisation and functionality of electronic devices soars, understanding the creep and random vibration of solder joints (SJs) in BGA packages in devices is critical to achieving high device reliability. This research employs Finite Element Analysis (FEA) to evaluate...

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Principais autores: Joshua A. Depiver, Sabuj Mallik, Emeka H. Amalu
פורמט: Artigo
שפה:Inglês
יצא לאור: Elsevier 2025-06-01
סדרה:Power Electronic Devices and Components
נושאים:
Solder joint reliability
Finite Element Analysis (FEA)
Creep response
Random vibration
Ball Grid Array (BGA)
גישה מקוונת:http://www.sciencedirect.com/science/article/pii/S2772370425000100
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