Recent developments in advanced polymeric materials for solder mask application: Progress and challenges
With the miniaturization of electronic components and higher density of electrical connections in the printed circuit boards, the properties of conventional solder masks are unfit for these ever-growing requirements, especially when subjected to extreme processing and application conditions. This ha...
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| Principais autores: | , , , , |
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| Format: | Artigo |
| Sprog: | Inglês |
| Udgivet: |
Elsevier
2023-09-01
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| Serier: | Journal of Science: Advanced Materials and Devices |
| Fag: | |
| Online adgang: | http://www.sciencedirect.com/science/article/pii/S2468217923000369 |
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