Recent developments in advanced polymeric materials for solder mask application: Progress and challenges
With the miniaturization of electronic components and higher density of electrical connections in the printed circuit boards, the properties of conventional solder masks are unfit for these ever-growing requirements, especially when subjected to extreme processing and application conditions. This ha...
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| 主要な著者: | , , , , |
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| フォーマット: | Artigo |
| 言語: | Inglês |
| 出版事項: |
Elsevier
2023-09-01
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| シリーズ: | Journal of Science: Advanced Materials and Devices |
| 主題: | |
| オンライン･アクセス: | http://www.sciencedirect.com/science/article/pii/S2468217923000369 |
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