Research Progress on the Solder Joint Reliability of Electronics Using in Deep Space Exploration
Abstract The spacecraft for deep space exploration missions will face extreme environments, including cryogenic temperature, intense radiation, wide-range temperature variations and even the combination of conditions mentioned above. Harsh environments will lead to solder joints degradation or even...
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| Principais autores: | , , , , , , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado: |
KeAi Communications Co., Ltd.
2023-02-01
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| Series: | Chinese Journal of Mechanical Engineering |
| Assuntos: | |
| Acceso en liña: | https://doi.org/10.1186/s10033-023-00834-4 |
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