Patterning Fidelity Enhancement and Aberration Mitigation in EUV Lithography Through Source–Mask Optimization
Extreme ultraviolet (EUV) lithography faces critical challenges in aberration control and patterning fidelity as technology nodes shrink below 3 nm. This work demonstrates how Source–Mask Optimization (SMO) simultaneously addresses both illumination and mask design to enhance pattern transfer accura...
שמור ב:
| Principais autores: | , , , , |
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| פורמט: | Artigo |
| שפה: | Inglês |
| יצא לאור: |
MDPI AG
2025-10-01
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| סדרה: | Micromachines |
| נושאים: | |
| גישה מקוונת: | https://www.mdpi.com/2072-666X/16/10/1166 |
| תגים: |
אין תגיות, היה/י הראשונ/ה לתייג את הרשומה!
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