Engineering SiO2 Nanoparticles: A Perspective on Chemical Mechanical Planarization Slurry for Advanced Semiconductor Processing
Chemical mechanical polishing (CMP) is a process that uses mechanical abrasive particles and chemical interaction in slurry to remove materials from the surface of films. With advancements in semiconductor device technology applying various materials and structures, SiO2 (silica) nanoparticles are t...
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| Asıl Yazarlar: | , , , , |
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| Materyal Türü: | Artigo |
| Dil: | Inglês |
| Baskı/Yayın Bilgisi: |
Hosokawa Powder Technology Foundation
2023-12-01
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| Seri Bilgileri: | KONA Powder and Particle Journal |
| Konular: | |
| Online Erişim: | https://www.jstage.jst.go.jp/article/kona/42/0/42_2025001/_html/-char/en |
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