Engineering SiO2 Nanoparticles: A Perspective on Chemical Mechanical Planarization Slurry for Advanced Semiconductor Processing

Chemical mechanical polishing (CMP) is a process that uses mechanical abrasive particles and chemical interaction in slurry to remove materials from the surface of films. With advancements in semiconductor device technology applying various materials and structures, SiO2 (silica) nanoparticles are t...

詳細記述

書誌詳細

主要な著者:	Ganggyu Lee, Kangchun Lee, Seho Sun, Taeseup Song, Ungyu Paik
フォーマット:	Artigo
言語:	Inglês
出版事項:	Hosokawa Powder Technology Foundation 2023-12-01
シリーズ:	KONA Powder and Particle Journal
主題:	cmp (chemical mechanical polishing) silica nanoparticles synthesis modification surface functionalization core–shell structure
オンライン･アクセス:	https://www.jstage.jst.go.jp/article/kona/42/0/42_2025001/_html/-char/en
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